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of mechanical and industrial engi- neering, Northeastern University, 360 Huntington Ave., Boston, MA 02115, 617.373.5558, h.huang@neu.edu, ilab. coe.neu.edu. The authors acknowledge finan- cial support from the Department of Energy Office of Basic Energy Sciences (DE-SC0014035), and Hanchen Huang also thanks Jianmin Qu for suggesting applications involving heat sinks. References 1. S. Kalpakjian and S. Schmid, Manu- facturing Engineering and Technology , 7th Ed., Pearson, Upper Saddle River, NJ, 2014. 2. J. Lewis, Material Challenge for Flex- ible Organic Devices, Mater. Today , Vol. 9, p 38-45, 2006. 3. S.R. Harshorn, Structural Adhesives: Chemistry and Technology, Plenum Press, New York, NY, 1986. 4. R.B. Fair, Challenges to Manufac- turing Submicron, Ultra-Large Scale Integrated Circuits, Proceedings of the IEEE , Vol 78, p 1687-1705, 1990. 5. R. Viswanath, et al., Thermal Per- formance Challenges from Silicon to Systems, Intel Technol. J., Vol 4, No. 3, p 1-16, 2000. 6. J.A. King, Material Handbook for Hybrid Microelectronics , Artech House, Norwood, MA, 1988. 7. H.D. Young, University Physics , 7th Ed., Addison Wesley, Reading, MA, 1992. 8. J.P. Gwinn and R.L. Webb, Perfor- mance and Testing of Thermal Inter- face Materials, Microelectr. J ., 2003. 9. G. Henshall, J. Bath, and C.A. Hand- werker, Lead-Free Solder Process Devel- opment , Wiley, Hoboken, NJ, 2011. 10. A. DerMarderosian and V. Gionet, The Effects of Entrapped Bubbles in Solder Used for the Attachment of Leadless Ceramic Chip Carriers, Reli- ability Physics Symposium , p 235-241, 1983. 11. S.P Stagon, P.R. Elliott, and H.C. Huang, Low-Temperature Welding with Spaced Nanorods and Eutectic Alloys, U.S. Patent Application No. 62/196,684, 2015. Acknowledgments

12. M.M. Hawkeye and M.J. Brett, Glancing Angle Deposition: Fabrication, Properties, and Applications of Micro- And Nanostructured Thin Films, J. Vac. Sci. Technol. A , Vol 25, p 1317-1335, 2007. 13. L.G. Zhou, and H.C. Huang, Small- est Separation of Nanorods from Phys- ical Vapor Deposition, Appl. Phys. Lett. , Vol 100, p 141605, 2012. 14. X.B. Niu, et al., Smallest Metallic Na- norods Using Physical Vapor Deposition, Phys. Rev. Lett. , Vol 110, p 136102, 2013.

15. S.P. Stagon and H.C. Huang, Airtight Metallic Sealing at Room Temperature under Small Mechanical Pressure, Sci. Rep ., Vol 3, No. 3066, 2013. 16. Y. Lu, et al., Cold Welding of Ultra- thin Gold Nanowires, Nat. Nanotech- nol ., Vol 5, p 218-224, 2010. 17. S.P. Stagon and H.C. Huang, Low-temperature Bonding and Sealing with Spaced Nanorods, International Patent No. WO/2014/205193, 2014.

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