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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 20 NO. 4 12 ABOUT THE AUTHORS

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SebastianBrand is a senior scientist at the Fraunhofer IMWS, Germany, where he leads a research, development, and application team for non-destructive defect localization in the field of failure analysis and metrology in microelectronics. Sebastian holds a Ph.D. in electrical engineering from the University of Magdeburg, Germany. In 2004 and 2005 he joined the University of Toronto and Ryerson University in Toronto as a post-doctoral fellow working in the field of cancer research with a focus on ultrasonically-based methods for early detection of treatment responses. Sebastian has 18 years of experience in the field of acoustics in life and material sciences and authored more than 65 publications. His current research extends fromacousticmethods (scanning acousticmicroscopy)

over lock-in-thermography to magnetic micro-imaging where he and his team undertake R&D of non-destructive defect localization and characterization to address challenges arising from novel technologies, such as 3D integration.

Frank Altmann received his diploma in physics from the Technical University, Dresden. He is head of the diagnostics of semiconductor technologies research group at Fraunhofer IMWS-CAM. His main research field is failure analysis on Si- and III/V-based electronic devices. He currently works on newdevelopments of advanced defect localization, site-specific preparation, and physical failure analysis techniques for new3D packaging technologies. He has authoredmore than 50 publications, has five patents, and lectures in the master’s program in mechatronics, industrial engineering, and physical engineering at the University of Applied Sciences Merseburg.

Michael Kögel graduated from the University of Applied Sciences in Leipzig in 2015 with a degree in electrical engineering and information technology. Hewrote hismaster’s thesis at Fraunhofer IMWS- CAM, onmethods and techniques for exploring spectral extractionof Rayleighwaves on solid interfaces with GHz-SAM. Since 2015, Kögel has worked as an engineer for failure analysis of semiconductor components at IMWS-CAM and is member of the team for non-destructive defect localization in the field of failure analysis and metrology in microelectronics. His experience includes application and development for scanning acousticmicroscopy, lock-in-thermography andmagnetic current imaging.

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