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(red solid and dashed curves). The model puts the fault 100 µm after the bare substrate termination, in good agreement with the confirmed fault location. The next steps will focus on improving the fitting algorithm and implementing a fault-finding methodology, which will allow the fault location to be easily extracted with a high degree of accuracy from the simulated data. REFERENCES 1. Y. Cai, Z. Wang, R. Dias, and D. Goyal: “Electro Optical Terahertz Pulse Reflectometry - An Innovative Fault Isolation Tool,” Proc. IEEE Electronic Components and Technology Conference (ECTC), June 2010, p. 1309-1315. 2. M.Y. Tay, L. Cao, M. Venkata, L. Tran, W. Donna, W. Qiu, J. Alton, P.F. Taday, and M. Lin: “Advanced Fault Isolation Technique Using Electro-Optical Terahertz Pulse Reflectometry,” Proc. IEEE International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA), July 2012, p. 1-5. 3. L. Cao, M. Venkata, M.Y. Tay, W. Qiu, J. Alton, P.F. Taday, and M. Igarashi: “Advanced Fault Isolation Technique using Electro- Optical Terahertz Pulse Reflectometry (EOTPR) for 2D and 2.5D Flip-Chip Package,” Proc. 38th International Symposium for Testing and Failure Analysis (ISTFA), November 11-15, 2012, p. 21-25. 4. S. Barbeau, J. Alton, and M. Igarashi: “Electro Optical Terahertz Pulse Reflectometry - a Fast and Highly Accurate Non-destructive

Fault Isolation Technique for 3D Flip Chip Packages,” Proc. 39th International Symposium for Testing and Failure Analysis (ISTFA), November 3-7, 2013, p. 264-269. 5. C. Schmidt, P.S. Pichumani, J. Alton, M. Igarashi, L. Chan, and E. Principe: “Advanced Package FA Flow for Next-Gen Packaging Technology using EOTPR, 3DXRAY & Plasma FIB,” Proc. 42nd Inter- national Symposium for Testing and Failure Analysis (ISTFA), November 6-10, 2016. 6. B. Zee, W. Qiu, J. Alton, T. White, and M. Igarashi: “Non-Destructive Fault Localization in 2.5D Packages Using Electro Optical Terahertz Pulse Reflectometry,” Proc. 43rd International Symposium for Testing and Failure Analysis (ISTFA), November 5-9, 2017. 7. Yi-Sheng Lin, Yu-Hsiang Hsiao, and Shu-Hua Lee, “Application of Electro Optical Terahertz Pulse Reflectometry for Fault Localization and Defect Analysis,” Proc. 43rd International Symposium for Testing and Failure Analysis (ISTFA), November 5-9, 2017. 8. K.C. Lee, J. Alton, M. Igarashi, and S. Barbeau: “Feature Based Non- Destructive Fault Isolation in Advanced IC Packages,” Proc. 40th International Symposium for Testing and Failure Analysis (ISTFA), November 9-13, 2014, p. 214-218. 9. E. Kowalczuk, A. Bhattacharya, K.C. Lee, J. Alton, M. Igarashi, and S. Barbeau: “Fault Localisation of Defects using Electro Optical Terahertz Pulse Reflectometry and 3D EM Modelling with Virtual Known Good Device,” Proc. IEEE 3D Systems Integration Conference, December 2014.

ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 20 NO. 4

ABOUT THE AUTHORS

Jesse Alton has an M.Sci. degree in physics from the University of London, Royal Holloway. He went on to work at the Pacific Northwest National Laboratory in Richland, Wash. There he studied the vitrification of high level nuclear waste before returning to the U.K. to complete a Ph.D. at the University of Cambridge where he focused on development of high power terahertz sources and their applications. Alton joined TeraView Ltd. in April 2005 where he is the applications and product manager of the Semiconductor Group. He has authored or co-authored over 50 published papers.

Thomas White completed his master’s degree and Ph.D. at the University of Warwick, U.K., before a brief foray into academic research at the Max Planck Institute for Solid State Research, Germany. Returning to the U.K., he joined TeraViewLtd. inOctober 2015 as an applications and customer support engineer in the Semiconductor Group.

Martin Igarashi has over 25 years of experience in the roles of engineering, applications engineering, sales andmarketing, M&A, product development, and generalmanagement of product divisions in the EDA, plasma etch, photolithography, test and measurement, and laser material processing industries. He has worked for companies such as Electro Scientific Industries, Toppan, ETEC Systems, Applied Materials, and Tektronix. He earned a bachelor’s degree in applied mathematics from the University of California, Santa Barbara. He currently heads TeraView’s semi- conductor business and is based in Portland, Ore.

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