November_EDFA_Digital

ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 20 NO. 4 52 DIRECTORY OF Rosalinda M. Ring, Lam Research rose.ring@lamresearch.com 308 S. Abbott Ave. Milpitas, CA 95035 408.719.1617 sales@advancedcircuitengineers.com advancedcircuitengineers.com

INDEPENDENT FA PROVIDERS

E lectronic companies of all types and sizes require failure analysis (FA) services. Our goal is to supply a resource of FA service providers for your reference files. The directory lists independent providers and their contact information, expertise, and types of technical services offered. ADVANCED CIRCUIT ENGINEERS LLC

ANALYTICAL RESEARCH AND TESTING LABORATORY (ARTL) 2907 East Chamber Street Phoenix, AZ 85040 602.393.8158 kbailey@artl-llc.com artl-llc.com/capabilities ServicesOffered: Failureanalysisandreverseengineering. Tools and Techniques: Optical microscopy, macro digital imaging, SEM/EDX, optical emission spectroscopy analyz- er, FTIR analyzer (ATR method), and Rockwell superficial hardness test. CMC LABORATORIES INC. 7755 South Research Drive, Suite 115 Tempe, AZ 85284 480.496.5000 cmclaboratories.com Services Offered: Materials characterization, failure analysis, process development, and technology resource. Tools and Techniques: Ion milling/polishing, EDS, real- time x-ray analysis, chemical/mechanical decapsulation, reactive ion etching, metallographic cross-sections, precision sub-micron cross-sections, competitive analy- sis, micro-hardness testing, SEM analysis and imaging, mechanical testing, laser flash thermal conductivity, dif- ferential scanning calorimetry (DSC), prototype plating, image analysis, materials-related consulting, electrical testing, special projects, temperature cycle video imaging, test automation and circuit design. EMPA Ueberlandstrasse 129 8600 Dübendorf Switzerland +41 58 765 11 11; +41 58 765 4288 empa.ch Services Offered: Research to innovations; Coating Com- petence Center, Electron Microscopy Center, Center for X-Ray Analytics, Reliability Center, and Swiss Competence Centers for Energy Research. Tools and Techniques: High-resolution scanning trans- mission electronmicroscopy (<60 Pm), super EDX system,

Services Offered: Frontside and backside FIB circuit edit, dual-beamSEM-FIB imaging and samplepreparation, TEM and STEM imaging, consultations, and FIB layout design. Tools and Techniques: Backside sample preparation for FIB, sub-Å resolution probe-corrected STEM imaging, large area windowless EDS detector (0.45sr), EELS quan- tification andmapping, tomography and holography, ion beam nano-machining, EDX, analysis on small samples and 12-in. wafers.

ALTER TECHNOLOGY MADRID c/. Tomas Alba Edison, 4 41920 Sevilla Spain +34 95 446 70 50 wpo-altertechnology.com

Services Offered: High reliability components engi- neering, testing, and failure analysis, materials charac- terization, packaging and assembly, certification and equipment testing, counterfeit detection, authenticity tests, radiation testing, evaluation/qualification, electrical characterization, assembly processes, and design. Tools and Techniques: External visual inspection, bond pull test, particle impact noise detection (PIND), decap- sulation, CSAM, metallurgical analysis, metallography and cross-sectioning, SEM, FTIR spectroscopy, mechani- cal testing (tension, compression, shear), vibration and fatigue testing, electronic component parametric testing from DC to RF, electronic component digital and analog curve tracing, electronic component functional testing, real-time micro focus x-ray inspection (2D and 3D), com- ponent decapsulation anddelidding, solderability testing, plating and coating thickness measurement, electronic component functional testing, screening of electronic components (visual inspection, electrical test, x-ray and SAM), fine and gross leak testing.

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