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• E. Oveisi, A. Letouzey, D.T.L. Alexander, et al.: “Tilt-Less 3D Electron [STEM] Imaging and Reconstruction of complex Curvilinear Structures,” Sci. Rep., 2017, 7, p. 10630. • I. Santos, M. Ruiz, M. Aboy, et al.: “Identification of Extended Defect Atomic Configurations in Silicon through Transmission Electron Microscopy Image Simulation,” J. Electron. Mater., 2018, 47, p. 4955. • C. Sun, E. Müller, M. Meffert, et al.: “On the Progress of Scanning Transmission ElectronMicroscopy (STEM) Imaging ina Scanning ElectronMicroscope,” Microsc. Microanal., 2018, 24, p. 99. • T. Taniuchi, Y. Kotani, and S. Shin: “Ultrahigh-Spatial- Resolution Chemical and Magnetic Imaging by

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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 20 NO. 4

ABOUT THE COVER a) SEMmicrograph of degraded wire bond joints due to excessive heat caused by EOS. Note the high degree Au-Al inter- metallic compound (IMC) formation around the Au ball bonds. Photo by Bence Hevesi, Robert Bosch Kft., Second Place Winner, Black & White Images. b) Low KeV STEM bright field image showing CMP-caused poly defect that resulted in leakage failure. Photo by Nathan Wang, Maxim Integrated, Third Place Winner, Black & White Images. c) After using an acid etch on this cross-sectioned sample to delineate the PN junction, the short circuit of this transistor became obvious. Photo by David Jarrett, Hi-Rel Laboratories, Second Place Winner, Color Images. d) Imagine the surprise when finding this elephant was hiding in the edges as the part was delayered. What other wild things are hiding in there? Photo by Tammy Berger, Naval Surface Warfare Center, Third Place Winner, Color Images. e) “High Voltage Rose.” During a 600 volt wafer process development cycle, an anomalous foreign particle landed in the gate poly patterning zone, blocking the poly etch and leaving extra features that also disrupted the contact pattern- ing. Photo by Ian Kearney, Texas Instruments, Second Place Winner, False Color Images. All images from the 2017 EDFAS Photo Contest.

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